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NexPlanar Corporation designs, tests, and manufactures highly specialized CMP pads using proprietary “nano-domain” technology for the production of advanced semiconductors and hard drives. Utilizing a very repeatable compression molded manufacturing process, our unique solo pad technology provides improved planarity and across the wafer uniformity and can be utilized to customize the pads for specific applications. The application specific CMP pads can be tuned, for example, for sensitive structures on the device by varying the hard and soft domains of the pad. NexPlanar’s “nano-lubricants” and patented molded groove technologies allow for low stress CMP (required for the most advanced CMP applications), result in an order of magnitude fewer defects, and allow the use of low slurry consumption processing. Offering Application Specific Technology NEX 3 Advanced Planarizing Pad Technology
NexPlanar Corporation is a privately held company, headquartered in Hillsboro, Oregon. |
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