"Leading Next Level Planarization"

NexPlanar builds the next generation of chemical mechanical planarization (CMP) pads for the semiconductor device industry. Our propriety nano-domain technology coupled with patented molded grooves and the unique ability to tune the pads results in dramatically improved yields and lower cost of ownership with extended pad life.

The company manufactures in Hopkins, Minnesota and at its new headquarters in Hillsboro, Oregon.

7425 NW Evergreen Parkway
Suite 150
Hillsboro, OR 97124
Tel (503) 619-2345
Fax (503) 439-6408