Leading the CMP revolution

NexPlanar CMP pads use proprietary formulation and fabrication methods-the very latest in modern chemistry and technology advances-to bring new levels of quality, consistency, yield and cost control to your CMP applications.

Improve Planarity and Uniformity Across Wafers

NexPlanar pads use proprietary formulations to provide the right hardness, pore sizes, compressibility and groove profiles for each of your CMP applications. By fine-tuning pads for every process, you improve planarity and uniformity across wafers.

Maximize Yield and Decrease Defectivity

The molded grooves in NexPlanar pads eliminate the sharp edges and burrs of traditional, cut grooves. The result? Higher polish quality, fewer scratches, and lower dishing, erosion and rework rates. And with NexPlanar's unrivaled pad-to-pad quality, you can depend on that quality with each and every batch.

Enable Low-Stress CMP for Advanced Applications

NexPlanar has an extensive line of CMP pads that balance effective removal rates with gentler wafer polishing to address the strictest tolerances. As CMP requirements become more demanding, you can depend on NexPlanar to produce the pads you need to get the job done right.

Control CMP Costs with Longer Pad Life and Less Downtime

NexPlanar's proprietary formulations and molding produces superior pads that last longer and maintain polish quality and consistency over the life of the pad. So you need fewer pads and you change them far less often-to provide the lowest cost of ownership in the industry.

Test New CMP Applications Faster and More Thoroughly

Proper CMP testing drives higher quality and maximizes yields. NexPlanar stands ready to provide the custom pad samples and normalized batch data you need to accelerate test cycles, optimize pad refinements and test pads, disks, slurries and configurations more thoroughly.