NexPlanar: The State of CMP Art

After years of following a strategy that one CMP pad fits all applications, new breakthroughs have sparked a revolution in wafer polishing. NexPlanar technology leads the way in the transformation of CMP processes.

NexPlanar’s CMP Technology Breakthroughs

NexPlanar’s state-of-the-art pads feature a variety of patented and patent-pending technologies that make them superior for your CMP applications.

Proprietary, high performance pad formulations

• Polyurethane thermoset polymer
• Stable thermal and mechanical properties
• Robust resistance to wear and to CMP chemical environments

In-situ formed grooves

• Highly uniform groove dimensions within each pad
• Extremely reproducible properties from pad-to-pad
• Greater usable groove depth with very smooth, clean surfaces
• Fewer defects and micro-scratches

Lubricant additive within the pad

• Controlled, low coefficient of friction
• Reduced shear-force-induced damage

Solo pad design

• Manufactured using NexPlanar’s proprietary molding process
• Optimal planarization performance
• Material properties provide excellent polish uniformity

Experience the State of CMP Art

If you are interested in maximize yield, quality and predictability while enjoying the lowest overall costs in the industry, let us know. We will show you why NexPlanar CMP pads should be a crucial component of your CMP strategies—now and in the future.