There is nothing you can do to have a greater impact on your planarization yields and costs than by using the right NexPlanar pad for each of your CMP applications.

NexPlanar’s Advanced Pad Technology

As the technology leader in CMP pads, NexPlanar starts with better materials and formulations. Our CMP pad polymer matrix provides superior characteristics. We precision-mold our pads individually with in-situ grooves that have uniform, high integrity wall profiles. And to optimize your polishing processes, we customize each and every pad to the precise requirements of your CMP applications.

Better Technology Makes NexPlanar Pads Superior

NexPlanar pads stand alone at the top of the CMP market because they are made with:

• Customizable urethane pad formulations that deliver a range of densities, porosities, and hardness and provide uniformity within each pad
• Molded, in-situ grooves that provide uniformity, effective erosion rates, excellent slurry distribution and significantly fewer micro-scratches
• Very repeatable proprietary manufacturing process that improve planarity and uniformity across wafers, as well as unrivaled consistency over the life of each pad, and from pad-to-pad

NexPlanar: The State of CMP Art™

Welcome to the CMP revolution. At NexPlanar, we are eager to show you how we can bring the very latest technologies to bear on your CMP challenges. Our diverse line of advanced pads can increase quality, improve yields and control costs, as well as enable the low-stress CMP required for even the most advanced applications. Contact us today to find out how the latest in CMP advances can bring a new polish to your CMP operations.