NexPlanar's solo CMP pad technology consists of both soft and hard segments in the polymer matrix that provides desirable elastic and viscous characteristics. Our pads are compression molded with proprietary in-situ groove design. The in-situ grooves ensure uniform, high integrity wall profiles that provide better slurry distribution and efficiency.

By design, via our “void engineering” concept, our pads have a “designed-in” porosity and surface roughness different than those for the current leading products offered today. These features provide dramatic improvement for pattern density insensitivity and lower defect adders while maintaining the desirable removal rates.

Our “graded” pad technology offers the ability to custom tune the wafer profile across the wafer.